| 摘要 |
The two-phase cooling module (200) for electronic components includes a first cooling chamber member (210) press formed as a unitary member having an offset surface and a perimeter surface. A second cooling chamber member (212, 600), such as a flat sheet, serves as cooling chamber member and is brazed to the perimeter surface. A non-integral support member (500) is interposed between the first cooling chamber member and the cover (600) and is located within the cooling cavity. In an alternative embodiment, the cooling cavity is defined by two cooling chamber members, each of which are press formed as separate unitary members (210, 212) each having offset surfaces and corresponding perimeter surfaces.
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