| 摘要 |
A packaging structure at least comprises: a printed circuit substrate having an insulating structure made of high polymer composite material and a trace conductor structure interlacing within the insulating structure; a plurality of leads arranged on the periphery of the printed circuit substrate and connected to the printed circuit substrate; a chip bonded and connected onto the printed circuit substrate; and an encapsulant material that encapsulates the chip, the printed circuit substrate, and inner portions of the leads.
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