发明名称 |
Deformation-absorbing leadframe for semiconductor devices |
摘要 |
A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member. |
申请公布号 |
US6455922(B1) |
申请公布日期 |
2002.09.24 |
申请号 |
US20000599778 |
申请日期 |
2000.06.21 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ARGUELLES RONALDO M.;ALVARADO REYNANTE T.;RIMPILLO, JR. LEONARDO S.;WEYGAN TEDDY D. |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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