发明名称 VACUUM TREATMENT APPARATUS AND SUBSTRATE FEED METHOD THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus capable of preventing the feed mistake of a substrate, and a substrate feed method in the vacuum treatment apparatus. SOLUTION: In the substrate feed method in the vacuum treatment apparatus for performing the feed of the substrate 5 in and out of the placing part 7a in a vacuum chamber 2a, the substrate 5 is held in a horizontal posture in a feed-in guide part 10 at the time of feed-in operation to be allowed to stand by and the feed-in guide part 10 is allowed to approach the placing part 7a by a cylinder 15 when the vacuum chamber 2a is in an open state to be connected to a substrate guide part 8, and the substrate 5 on the feed-in guide part 10 is moved on the placing part 7a by a feed-in arm 13. At the time of feed-out operation, a feed-out guide part 11 is allowed to approach the placing part 7a by a cylinder 18 to be connected to the substrate guide part 8 and the substrate 5 on the placing part 7a is fed out to the feed-out guide part 11 by a feed-out arm 14. By this constitution, the discontinuous part of the guide part is not generated at the time of feed of the substrate 5 and the feed in and out of the substrate 5 can be certainly performed.
申请公布号 JP2002273197(A) 申请公布日期 2002.09.24
申请号 JP20010075799 申请日期 2001.03.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FURUKAWA RYOTA
分类号 B65G25/08;B01J3/00;B01J3/02;B65G49/06;H01L21/302;H01L21/3065;H01L21/31;H01L21/677;H01L21/68;(IPC1-7):B01J3/00;H01L21/306 主分类号 B65G25/08
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