发明名称 Stroke and pressure adjusting device for solder machine
摘要 A stroke and pressure adjusting device is used for the soldering process of a soldering machine which has a driving device for driving a soldering device of the soldering machine to solder, and the driving device has a driving shaft on which the stroke and pressure adjusting device is attached. The stroke and pressure adjusting device comprises a thread sleeve mounted on the driving shaft of the driving device, a slider mounted on the thread sleeve, and a spring mounted between the slider and the driving device, wherein the distance between the thread sleeve and the driving device is adjustable so as to adjust the stroke of the driving device, the distance between the slider and the driving device is adjustable and the distance between the slider and the driving device is adjustable so as to adjust the elastic force generated by the spring, thereby adjusting the operating pressure of the driving device.
申请公布号 US6454155(B1) 申请公布日期 2002.09.24
申请号 US20010933728 申请日期 2001.08.22
申请人 HANNSTAR DISPLAY CORP. 发明人 LIU KANG TING
分类号 B23K3/00;B23K3/08;B23K31/02;B23K37/02;B23K101/36;(IPC1-7):B23K37/02 主分类号 B23K3/00
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