| 摘要 |
<p>One subject of the invention relates to a card comprising an electronic element (2) and a coil (42) the extremities of which are linked directly to the electronic element, the latter and the coil being embedded in a binder (10). Another subject of the invention relates to a card comprising an electronic element (2) embedded in a binder (10) and a structure (46) for positioning the electronic element, this structure being situated in a layer (38) formed by the binder. The present invention also relates to a process for manufacturing cards according to the invention. <IMAGE></p> |
