| 摘要 |
The invention relates to a method for producing structures on the surface of a semiconductor wafer, in which after the generation of a primary layout corresponding to the structures to be produced in accordance with predetermined desired physical parameters of the structures, calculation of the parasitic fault parameters that would result from the semiconductor structures after production using the primary layout, correction of the layout to suit the results of the step of calculating the parasitic fault parameters, and production of a mask based on the layout that has been corrected to suit the parasitic fault parameters, the surface of a semiconductor wafer is structured using an etching process. The structuring process leads to production- or technology-dictated deviations from the shapes that are produced on the mask based on the corrected layout, and the primary layout is corrected on the basis of the production- or technology-dictated deviations of the structures.
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