| 发明名称 |
Method of filling plated through holes |
| 摘要 |
A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.
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| 申请公布号 |
US6453549(B1) |
申请公布日期 |
2002.09.24 |
| 申请号 |
US19990460278 |
申请日期 |
1999.12.13 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATT ANILKUMAR C.;HOUSER DAVID E.;WELSH JOHN A. |
| 分类号 |
H05K3/40;H05K3/42;(IPC1-7):H05K3/30 |
主分类号 |
H05K3/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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