发明名称 Permanganate desmear process for printed wiring boards
摘要 A desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins or bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a mixture of gamma-butyrolactone and water to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with an aqueous acidic neutralizer to neutralize and remove the permanganate residues. The gamma-butyrolactone is effective as a single solvent for softening and swelling resin smears from substrates made from epoxy, polyimide, cyanate ester resins, bis-maleimide triazine epoxy resins, and polyimide resins.
申请公布号 US6454868(B1) 申请公布日期 2002.09.24
申请号 US20000550881 申请日期 2000.04.17
申请人 ELECTROCHEMICALS INC. 发明人 POLAKOVIC FRANK;YANG WILLIAM;THORN CHARLES EDWIN;CARANO MICHAEL VAL;LAFAYETTE BETH ANN
分类号 H05K3/00;(IPC1-7):C03C23/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址