发明名称 Method of patterning noble metals for semiconductor devices by electropolishing
摘要 An electropolishing process for high resolution patterning of noble metals, such as platinum, for forming various semiconductor devices, such as capacitors or wiring patterns is disclosed.
申请公布号 US6455370(B1) 申请公布日期 2002.09.24
申请号 US20000639089 申请日期 2000.08.16
申请人 MICRON TECHNOLOGY, INC. 发明人 LANE RICHARD H.
分类号 H01L21/02;H01L21/321;H01L21/3213;H01L21/768;(IPC1-7):H01L21/824 主分类号 H01L21/02
代理机构 代理人
主权项
地址