发明名称 |
ELECTROPLATING METHODS FOR FABRICATING MICROELECTRONIC INTERCONNECTS AND MICROELECTRONIC STRUCTURES FABRICATED THEREBY |
摘要 |
Microelectronic interconnections are fabricated by forming a via in a first face of a microelectronic substrate that extends only partially through the microelectronic substrate towards a second face thereof. The via includes a sidewall and a floor. An insulating layer is formed on the sidewall. A plating electrode is formed on the second face. Metal is electroplated in the via from the floor by passing plating current between t he plating electrode and the floor through the microelectronic substrate therebetween. The substrate then is thinned at the second face to expose the metal that was electroplated. Electroplated metal through-substrate interconnections thereby may be fabricated.
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申请公布号 |
CA2359608(A1) |
申请公布日期 |
2002.09.23 |
申请号 |
CA20012359608 |
申请日期 |
2001.10.22 |
申请人 |
JDS UNIPHASE CORPORATION |
发明人 |
DUDLEY, BRUCE W.;WOOD, ROBERT L.;SHEN, HONG |
分类号 |
C25D5/02;C25D7/12;H01L21/768;(IPC1-7):H01L21/768 |
主分类号 |
C25D5/02 |
代理机构 |
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