PHOSPHOROUS COPPER ANODE FOR ELECTROPLATING

摘要

PURPOSE: To provide a phosphorous copper anode for electroplating which does not deposit and form particles on the plating surface of a cathode, more preferably the phosphorous copper anode for electroplating for forming copper wiring of semiconductor devices by electroplating. CONSTITUTION: This phosphorous copper anode for electroplating has a composition containing 20 to 800 ppm phosphorus and 0.1 to <2 ppm oxygen and balance high-purity copper of >=99.9999 purity and has a structure having the average grain size of recrystallation within a range of 10 to 50 μm.