| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a conventional board mounted semiconductor device such that the heat conductivity drops and the electric properties deteriorate due to its structure and material property. SOLUTION: This semiconductor device has an anisotropic wiring board 20 which is made by pacing a plurality of conductive materials whose surfaces are covered and insulated into a bundle and bonding it with an insulating adhesive, and slicing it. A semiconductor element 22 is mounted on the first conductive material 11a on the board, and it is connected with an electrode pad 19a on the board by connecting material 23. The surrounding is sealed with sealing resin 24, thus constituting this semiconductor device therefore, the electric resistance between the top and bottom of the board and the inductance become remarkably small, and the semiconductor device which is excellent electric, thermal, and heat-radiative properties can be materialized since the semiconductor element is mounted on the first conductive material 11a made integrally on the top and bottom of the board. |
