发明名称 THERMOSETTING RESIN COMPOSITION AND METHOD FOR MANUFACTURING INSULATION RESIN SHEET FOR PRINTED WIRING BOARDS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an insulation sheet for a printed wiring board which makes a product simply and quickly discriminable in a process of manufacturing a plurality of layer built-up wiring boards. SOLUTION: A thermosetting resin composition for use in the insulation sheet for the printed wiring board contains a thermosetting resin, a curing accelerating compound, a flexible material and a coloring component as necessary components.
申请公布号 JP2002270974(A) 申请公布日期 2002.09.20
申请号 JP20010071817 申请日期 2001.03.14
申请人 HITACHI CHEM CO LTD 发明人 TOSAKA YUJI
分类号 C08J7/04;C08K5/00;C08L101/00;H05K1/03;H05K3/46;(IPC1-7):H05K1/03 主分类号 C08J7/04
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