发明名称 WIRING BOARD DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce a manufacturing cost without increasing the number of components. SOLUTION: A pair of lands 2A and 2B are formed in open circuit of a wire 2 on a board 1. If necessary, a chip component is mounted between the lands 2A and 2B or the lands 2A and 2B are shorted. In such a wiring board device, a pair of nearly L-shaped electrodes 2a and 2b are integrally formed with the lands 2A and 2B respectively. The leading ends of the nearly L-shaped electrodes 2a and 2b are close to each other like a hook with a specified spaceα.
申请公布号 JP2002271008(A) 申请公布日期 2002.09.20
申请号 JP20010061950 申请日期 2001.03.06
申请人 FUNAI ELECTRIC CO LTD 发明人 NAKA ISAO
分类号 H05K3/34;H05K1/02;(IPC1-7):H05K3/34 主分类号 H05K3/34
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