| 摘要 |
PROBLEM TO BE SOLVED: To cut off and evaluate an LSI single element, even after the completion of a non-defective MCM by selecting a nondefective LSI and mounting it to the MCM. SOLUTION: A cap substrate assembly 1a mounts LSIs 2a and 2b on its front surface and has soldering ball connection pads 5b, connected to the respective signal input/output terminals of the LSIs 2a and 2b on its rear surface. A main wiring substrate assembly 1b has the pads 5b opposing the assembly 1a on its front surface, has soldering ball connection pads 5b to be connected with the next wiring board on its rear surface and has a wiring pattern 12 and an inter-LSI wiring pattern 7, connecting the pads 5b on the front surface and the rear surface at an inner layer. Soldering balls 6b is electrically conducting and connects the pads 5b of the assembly 1a and the pads 5b of the assembly 1b.
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