| 发明名称 |
HEATING DEVICE AND ITS MANUFACTURING METHOD, AS WELL AS FILM FORMING DEVICE |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heating device capable of high temperature heating which can be manufactured at a low cost and its manufacturing method, as well as a film forming device to use this. SOLUTION: The heating device 10 is constituted by having a support board 11 composed of aluminum or aluminum alloy and supporting a substrate 100, a sheath heater 12 installed inside of the support board 11, and a support plate 13 installed inside of the support board 11 and composed of a metallic material possessing a melting point not less than 850 deg.C.</p> |
| 申请公布号 |
JP2002270346(A) |
申请公布日期 |
2002.09.20 |
| 申请号 |
JP20010066129 |
申请日期 |
2001.03.09 |
| 申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
OGURA KAZUMI;WATANABE KIYOSHI;FURUKAWA HIROFUMI |
| 分类号 |
H05B3/20;C23C16/458;C23C16/46;C30B25/10;C30B25/12;C30B31/12;H01L21/00;H01L21/205;H01L21/683;H05B3/10;H05B3/12;H05B3/18;H05B3/68;(IPC1-7):H05B3/20;H01L21/68 |
主分类号 |
H05B3/20 |
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