| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for a semiconductor package wherein an electric conductor is enabled to be fixed without using solder to a substrate and cost reduction is enabled by this. SOLUTION: This is the socket for the semiconductor package 1 constituted so that this is equipped with a substrate 2 and the electric conductors 3 composed of plural coil springs protruded in a face of one side of the substrate 2 and installed so that their direction of expansion and contraction are made nearly perpendicular to the face of this one side, and so that one end side of the electric conductor 3 is electrically connected with a terminal 13 of the semiconductor package 12. Plural pads (electrically conducting layer) 7 composed of conductors except solder are installed at a face of one side of the substrate 2. Other end sides of the electric conductors 3 are contacted with the pads 7, and retaining means to retain respective other and sides of the electric conductors 3 in a state that they are made contacted with pads 7 are installed.
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