| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module and a semiconductor chip, the manufacturing costs of which are reduced by reducing the kinds of the pressure resistance charateristic of a transistor inside a semiconductor chip. SOLUTION: Interfacing, between bare chips IP 2, 3, and so on, constituting a multi-chip module and the external device of the multi-chip module, is attained Via I/O dedicated bare chip IP1. Since an interface circuit with the external device is no provided at the bare chips IP 1, 2, and soon outside of an I/O dedicated bare IP1T, only the pressure resistance characteristic correspondint to the operation voltage of an inner circuit is required. As the result, only the transistor of reduced kinds of the pressure resistance characteristics has to be provided at the respective bare chips IP2, 3, and so on. |
