发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the short circuit of a wiring pattern 14 caused by the separation of a plated film. SOLUTION: Since the visible outline of a resist 16 passes over a through hole 24, the visible outline of the resist 16 never parallels a wiring pattern 14 in close vicinity to it. In short, since a plurality of through holes 24 are arranged in matrix form in a substrate 12, the direction of the wiring pattern 14 extending from the through hole 24 always forms a specified angle to the direction of the through holes 24 standing in a line. Accordingly, in case the fringe of the resist 16 passing over the through hole 24 flows out, the thin film of the resist 16 is not made slenderly on the wiring pattern 14, and a plated film is never formed slenderly on the thin film.
申请公布号 JP2002270728(A) 申请公布日期 2002.09.20
申请号 JP20010068213 申请日期 2001.03.12
申请人 ROHM CO LTD 发明人 MIYATA OSAMU;KISHIMOTO ICHIRO
分类号 H01L23/12;H01L23/31;H01L23/498 主分类号 H01L23/12
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