| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a built-up layer with a different thickness through an easy process. SOLUTION: Transfer plates 13 and 13' having conductive pastes 12a and 12a', and 12b and 12b' for wiring which are different in thickness, conductive pastes 12c and 12c' for a via hole, and insulating resin layers 13 and 13' are laminated on an internal layer wiring board IC while heated and pressed, to transfer the conductive pastes 12a and 12a', and 12b and 12b' for wiring, conductive pastes 12c and 12c' for the via hole, and insulating resin layers 14 and 14' to the top and reverse surface of the internal layer wiring board IC. |
