| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer material for forming a circuit, which is to be used for transferring a circuit pattern obtained from patterning a metal foil on an insulating board or ceramic green sheet, which is suitable for the increase in fineness of a circuit pattern, and which can relax the heat pressing conditions and enables to transfer the circuit pattern naturally and stably. SOLUTION: The transfer material 1 for forming a circuit comprises a base material 2, a curable pressure-sensitive adhesive layer 3 which is formed on the base material 2 and has a pressure-sensitive adhesiveness and is cured by irradiating with light and has a lower adhesiveness with respect to the metal foil after cured than before irradiated with light, and the metal foil 4 which is laminated on the curing type pressure-sensitive adhesive layer 3 to be patterned to form a circuit.
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