发明名称 |
APPARATUS FOR TREATING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To improve handling performance by improving the method for securing a protective tube inserted with a temperature measuring means. SOLUTION: The apparatus for treating a substrate comprises means 13 for holding the substrate 12, a treating container 5 being loaded with the holding means, a heater unit 2 surrounding the treating container, and means 10 for measuring the temperature in the treating container. The substrate treating system treats the substrate by introducing a treating gas into the treating container and heating the substrate up to a given temperature wherein the temperature measuring means is loaded into the protective tube 9 bonded to the treating container.
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申请公布号 |
JP2002270593(A) |
申请公布日期 |
2002.09.20 |
申请号 |
JP20010064297 |
申请日期 |
2001.03.08 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
HOSAKA EIJI;TATENO HIDETO;YANAGAWA HIDEHIRO |
分类号 |
C23C16/46;H01L21/22;H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
C23C16/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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