发明名称 APPARATUS FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve handling performance by improving the method for securing a protective tube inserted with a temperature measuring means. SOLUTION: The apparatus for treating a substrate comprises means 13 for holding the substrate 12, a treating container 5 being loaded with the holding means, a heater unit 2 surrounding the treating container, and means 10 for measuring the temperature in the treating container. The substrate treating system treats the substrate by introducing a treating gas into the treating container and heating the substrate up to a given temperature wherein the temperature measuring means is loaded into the protective tube 9 bonded to the treating container.
申请公布号 JP2002270593(A) 申请公布日期 2002.09.20
申请号 JP20010064297 申请日期 2001.03.08
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HOSAKA EIJI;TATENO HIDETO;YANAGAWA HIDEHIRO
分类号 C23C16/46;H01L21/22;H01L21/31;(IPC1-7):H01L21/31 主分类号 C23C16/46
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