| 摘要 |
PROBLEM TO BE SOLVED: To prevent attachment of contamination to a wafer in a rotary wafer treatment device. SOLUTION: This wafer treatment device for treating the surface while rotating a wafer has a wafer supporting section of a solid disk for supporting the wafer, and a cup for housing the wafer supporting section and the wafer. The cup has a tapered portion inclined towards the center. The cup and the wafer supporting section are formed so that the bottom surface of the wafer supporting section is higher than the lowest portion of the tapered portion at least while the wafer is being rotated.
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