| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding method which carries, fixes and bonds a thin semiconductor wafer, without damages such as crackings, breaking, or down of circuits, etc. SOLUTION: The method comprises a step of using a carrying tool 3 which has a sheet 2 laid on the downside of a protective ring 1, pasting a semiconductor wafer 201 onto the sheet 2 of the tool 3, carrying the semiconductor wafer 201 which is surrounded with the protective ring 1 from a housing to a bonding stage 110, bonding it on the stage 110, and carrying it out of the stage 110 to the housing.</p> |
