发明名称 POLISHING SLURRY
摘要 <p>PROBLEM TO BE SOLVED: To provide polishing slurry that can quickly perform polishing at stable polishing speed after polishing even if the amount of supply to the polishing cloth of a polishing apparatus becomes small. SOLUTION: The polishing slurry should contain a polishing abrasive. Viscosity should be at least 2 mPa.sec at a shear rate of 100/sec when shear stress is applied onto the polishing cloth. The amount of decrease in viscosity to original viscosity when the shear rate is changed from 100/sec to 500/sec should be 10% or more.</p>
申请公布号 JP2002270549(A) 申请公布日期 2002.09.20
申请号 JP20010068734 申请日期 2001.03.12
申请人 TOSHIBA CORP;SHIBAURA MECHATRONICS CORP 发明人 HIRABAYASHI HIDEAKI;INO TAKAO;SAITO AKIKO;MUKAI KIICHIRO;SAKURAI NAOAKI;KOBAYASHI NOBUO;HAYASHI TOSHIHIDE;YAMAUCHI KATSUHIKO
分类号 B24B37/00;C09K3/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B37/00
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