发明名称 |
POLISHING SLURRY |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide polishing slurry that can quickly perform polishing at stable polishing speed after polishing even if the amount of supply to the polishing cloth of a polishing apparatus becomes small. SOLUTION: The polishing slurry should contain a polishing abrasive. Viscosity should be at least 2 mPa.sec at a shear rate of 100/sec when shear stress is applied onto the polishing cloth. The amount of decrease in viscosity to original viscosity when the shear rate is changed from 100/sec to 500/sec should be 10% or more.</p> |
申请公布号 |
JP2002270549(A) |
申请公布日期 |
2002.09.20 |
申请号 |
JP20010068734 |
申请日期 |
2001.03.12 |
申请人 |
TOSHIBA CORP;SHIBAURA MECHATRONICS CORP |
发明人 |
HIRABAYASHI HIDEAKI;INO TAKAO;SAITO AKIKO;MUKAI KIICHIRO;SAKURAI NAOAKI;KOBAYASHI NOBUO;HAYASHI TOSHIHIDE;YAMAUCHI KATSUHIKO |
分类号 |
B24B37/00;C09K3/14;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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