| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component with a semiconductor chip connected to a substrate which keeps treatment effect by only pretreating it, prior to die bonding. SOLUTION: In the method of manufacturing an electronic component with a semiconductor chip connected to a substrate, a pretreatment prior to die bonding step, comprises installing a solid dielectric on at least one opposed surface of a pair of opposed electrodes under near the atmospheric pressure, introducing a process gas between the pair of opposed electrodes, applying a pulse-like electric field to obtain a plasma, and contacting the plasma with the substrate. |
