发明名称 SEMICONDUCTOR MODULE, COOLING DEVICE, AND POWER CONVERTER
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor module that can suppress abrupt temperature rise of a semiconductor element. SOLUTION: This semiconductor module has the semiconductor element 11, provided on a metal substrate 15 via an insulating substrate 13 and a heat accumulator 17, and the accumulator 17 is positioned immediately above and in the vicinity of the element 11, temporarily absorbs the heat of the element 11, by causing a phase change from a solid to a liquid at a temperature slightly lower than the workable upper limit temperature of the element 11, and radiates the heat thereafter.
申请公布号 JP2002270765(A) 申请公布日期 2002.09.20
申请号 JP20010068675 申请日期 2001.03.12
申请人 TOSHIBA CORP 发明人 KOTANI KAZUYA;OBE TOSHIHARU
分类号 H01L23/44;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L23/44
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