| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated wiring board, which can laminate a flat upper layer even on an internal layer material having an uneven surface or a through hole. SOLUTION: On both surfaces of the internal layer material 10 having internal layer patterns 12 and 12 formed on both surfaces of the core insulating layer 11, resin layers 13 and 14 are formed by applying liquid resin or laminating dry films. Then copper foils 15 and 15 are put on and pressed to harden the resin layers 14 and 14. The resin of the resin layers 14 and 14 is rich in flexibility, so it can move into an area 13 where the internal layer pattern 12 is coarse from the outside. Consequently, the copper foils 15 and 15 have high surface flatness even in the area 13. |
