发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the electrical characteristics of a semiconductor device. SOLUTION: A semiconductor device is constituted in such a way that a natural oxide film formed on the surface of a semiconductor wafer 11 is removed inside a film removal chamber 10f in an ion implantation device 1. After that, the wafer 11 is carried inside an impurity introducing chamber 10a in the device 1 without exposing the wafer 11 to an oxidizing atmosphere, and prescribed impurities are introduces in the wafer 11.
申请公布号 JP2002270535(A) 申请公布日期 2002.09.20
申请号 JP20010064992 申请日期 2001.03.08
申请人 HITACHI LTD 发明人 MITSUDA KATSUHIRO
分类号 H01L29/78;H01L21/265;H01L21/8238;H01L21/8242;H01L27/092;H01L27/10;H01L27/108 主分类号 H01L29/78
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