| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a planarizing device and a head which surely forms a bump, having a flat top face on which solder, gold or other metal will hardly deposit, even if the bump is pressed repeatedly. SOLUTION: The planarizing device 100 for forming the top of a solder bump 13 formed on an IC-mounting substrate 10 into a flat top face 16 comprises a head 131, having a flat pressing face 134 for pressing the top of the solder bump 13 and at least the pressing face 134 of the head 131 is made of ceramic.</p> |
