| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem associated with semiconductor devices with a semiconductor chip mounted on an insulating tape, where since the insulation tape has openings in an area to which the semiconductor chip is opposed, wiring for electrically connecting together electrodes on the semiconductor chip cannot be installed, and thus diffusion processes for the semiconductor chip are added accompanying/the wiring formed on the semiconductor chip is miniaturized. SOLUTION: A semiconductor chip 10 is placed on an insulation tape 12 without openings, and projected electrodes 17 formed on the electrode 11 on the semiconductor chip 10 are connected electrically together by inner leads 13 formed on the insulating tape 12, so that the increase of diffusion processes for forming wiring on the semiconductor chip 10 is avoided.</p> |
