发明名称 LAMINATED FILM AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a laminated film for which warpage is reduced, without the occurrence of blistering. SOLUTION: The laminated film comprises an organic insulating film, an adhesive layer, and a protective film layer. The thickness of the organic insulating film is between 3 and 80μm, the thickness of the adhesive layer is between 2 and 20μm, and the moisture content of the organic insulating film with the adhesive layer is between 0.3 and 3 wt.%.
申请公布号 JP2002270650(A) 申请公布日期 2002.09.20
申请号 JP20010382626 申请日期 2001.12.17
申请人 TORAY IND INC 发明人 TSUTSUMI YASUAKI;KAMEI RYUICHI;SHIMIZU TAKESHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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