| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component, the thickness of which can be reduce, its assembly and its manufacturing method. SOLUTION: In the assembly of the electronic component, the electronic component 10A of one example of this assembly constituted by connecting multiple electrodes arrayed by dual inline, e.g. of a large-size IC chip 10 respectively to the wiring electrodes 32 of a pair of terminal plates 37, and a small- size IC chip 20 are mounted on a mother board 50. In addition, the electronic component 10A is laminated and mounted, so as to straddle across the small-size IC chip 20 mounted on the board 50.
|
