| 摘要 |
PROBLEM TO BE SOLVED: To provide the holding structure of a heating component radiation which can reduce the rise in the temperature of the soldered part of the heating component to a substrate simply at low cost. SOLUTION: In the holding structure of a heating component 27 for radiation that lead parts 27b projected from a component main body 27a of the component 27 are soldered to a substrate 21 to dissipate the heat of the solder used for soldering, a heat insulating plate 30 is arranged at the position opposing to the substrate 21 at a prescribed distance from the substrate 21, and a component housing part 37 for holding the component 27 is provided in this plate 30. This housing part 37 is formed into a recessed shape, insertion holes 37a and 21c for inserting the leads 27b projected from the main body 27a are formed in the housing 37 and the substrate 21 respectively, the leads 27b are inserted in these insertion holes 37a and 21c, and the leads 27b and lands 24 on the rear surface of the substrate 21 are freely fixed on each other by soldering in a state that the main body 27a of the component 27 is separated from the bottom 37b of the housing part 37.
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