| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a wiring board where a wiring pattern is formed without using chemicals. SOLUTION: A laminate 5 where metallic foils 4 and a semi-hardenable resin sheet 3 are laminated is sandwiched by two metallic molds 1 and 2 where projecting wiring patterns 1-b and 2-b are formed on metallic plates 1-a and 2-a. The wiring board, where a metallic foil is cut at the projecting part of the metallic mold, the projecting wiring pattern is transferred on the surface of the laminate and the wiring pattern is formed, is manufactured. The projecting and recessing shape of the metallic mold where the wiring pattern is formed is transferred to the laminate where semi-hardenable resin is sandwiched by the metallic foils by the method of hot press. Thus, resource can be economized since the chemicals are not used.
|
