| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that can arrange many kinds of dummy elements on a plurality of chips provided on a semiconductor wafer at arranging of dummy elements which make characteristic evaluation on areas formed on the chips. SOLUTION: Many kinds of dummy elements are arranged on the plurality of chips provided on the semiconductor wafer by respectively arranging different kinds of dummy elements on dummy element arranging areas formed on the chips as one block.
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