发明名称 HEAT RADIATING SHEET AND METHOD FOR STICKING ELECTRONIC COMPONENT TO THE HEAT RADIATING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a method for sticking an electronic component to a heat radiating sheet, capable of radiating heat generated from this electronic component efficiently to the outside and preventing the occurrence of short circuit by arranging this heat radiating sheet at the electronic component, such as an integrated circuit. SOLUTION: The heat radiating sheet is provided with a heat radiating layer, consisting of a heat-radiation elastomer layer or a metal layer and a thermal conductive and thermal melting resin layer laminated on one face or on both of the faces of this heat radiating layer and melted by the heat generated from the electronic component. The thermal conductive and thermal melting resin layer is made to melt at a temperature than the soldering melting temperature.
申请公布号 JP2002270741(A) 申请公布日期 2002.09.20
申请号 JP20010068876 申请日期 2001.03.12
申请人 NITTO SHINKO KK 发明人 YAMAZAKI KAZUICHI;KATO OSAMU;AOYAMA TAKEHIRO
分类号 H05K7/20;H01L23/36;(IPC1-7):H01L23/36 主分类号 H05K7/20
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