摘要 |
PROBLEM TO BE SOLVED: To provide a method for sticking an electronic component to a heat radiating sheet, capable of radiating heat generated from this electronic component efficiently to the outside and preventing the occurrence of short circuit by arranging this heat radiating sheet at the electronic component, such as an integrated circuit. SOLUTION: The heat radiating sheet is provided with a heat radiating layer, consisting of a heat-radiation elastomer layer or a metal layer and a thermal conductive and thermal melting resin layer laminated on one face or on both of the faces of this heat radiating layer and melted by the heat generated from the electronic component. The thermal conductive and thermal melting resin layer is made to melt at a temperature than the soldering melting temperature.
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