| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a plastic package for charging solder resist with no bubbles remaining in a blind via. SOLUTION: In the manufacturing method for a ball grid array type plastic package 10, a core substrate 13 with copper foils 12 and 12a as each conductive circuit on both faces of an insulating substrate 11 is drilled from one side, and a via hole 17 is blocked on the other side with the copper foil 12a to form a blind via hole 18 while the generation of bubbles 22 in the blind via hole 18 is prevented. The manufacturing method includes a step of printing first photosensitive solder resist 14b on the opened side of the blind via hole 18, a step of removing the bubbles 22 which are sealed with the first solder resist 14b into the blind via 18 under vacuum, and a step of printing the second photosensitive solder resist 14c on both faces of the core substrate 13 and forming solder resist films 14 and 14a having opening parts on both sides in a photo-lithographic method.
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