| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mask, a manufacturing method thereof and a semiconductor device manufacturing method which raises the efficiency of the mask manufacturing and improves the machining precision of patterns. SOLUTION: The mask manufacturing method comprises a step of laminating a sacrificial film 112 and a conductive layer 108 on a substrate 111, a step of forming a metal film 102 having apertures 107 by electroplating and electrolytic polishing with a resist 113 used for a mold, a step of forming a metal film support (strut) 104 by electroplating and electrolytic polishing with a resist 114 used for a mold, a step of removing the resists 114, 113, a step of removing the conductive layer 108 on at least the apertures 107, and a step of removing the sacrificial film 112 to separate the substrate 111. The mask is thus manufactured and a semiconductor device is manufactured, using the same.</p> |
