| 摘要 |
PROBLEM TO BE SOLVED: To cool a wafer having a high temperature at a higher cooling rate to stabilize the temperature of the wafer more quickly. SOLUTION: A cooling apparatus 43 has a cooling plate 60 for cooling the wafer W placed thereon, and a cover 66 forming a processing chamber S with the cooling plate 60. A conduit 68 for flowing water having a constant temperature is provided in the cover 66 to control the cover 66 at a low temperature. The cover 66 is supported by a lifting mechanism 67 to be moved up and down. The inner circumference of the cover 66 is larger than the outer circumference of the cooling plate 60. When the wafer W is placed on the cooling plate 60 and cooled, the cover 66 is moved down to form a processing chamber S, and the cover 66 at the low temperature is brought near to the wafer W to facilitate the cooling of the wafer W.
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