发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED- CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique by which the lower electrode of a capacitance element can be formed with satisfactory reproducibility. SOLUTION: A ruthenium film 39 and a photosensitive film 40 are etched back at nearly the same rate in an ozone atmosphere at a treatment temperature of about 150 deg.C. The photosensitive film 40 and the ruthenium film 39 at the outside of a groove 38 are removed. Then, the photosensitive film 40 in the inside of the groove 38 is removed, and a lower electrode, in a desired shape and made of the ruthenium film 39, is formed in the inside of the groove 38.
申请公布号 JP2002270796(A) 申请公布日期 2002.09.20
申请号 JP20010063134 申请日期 2001.03.07
申请人 HITACHI LTD 发明人 TSUNEKAWA SUKEYOSHI;WATANABE KAZUTO;NAKAHARA MIWAKO;KUROKI KEIJI
分类号 H01L21/8234;H01L21/8242;H01L27/088;H01L27/10;H01L27/108 主分类号 H01L21/8234
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