| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for treating the surface of a mounting substrate capable of treating the mounting substrate in a short time without corroding electrodes even by exposing the substrate in the atmosphere after treating. SOLUTION: The method for treating the surface of the mounting substrate comprises the steps of introducing a reaction gas while exhausting a reaction chamber 1, applying a high-frequency power between a high-frequency electrode 5 in the chamber 1 and an opposite electrode 6 opposed to the electrode 5 to generate a plasma, mounting the substrate 10 on the electrode 5, and plasma treating the substrate. The method further comprises the steps of initially introducing an argon gas, plasma treating the substrate, then introducing an oxygen gas in a short time, plasma treating, removing readhered Br to prevent a corrosion of the electrode. The method also comprises the steps of initially introducing the oxygen gas, plasma treating the substrate, previously removing an oil component, an organic matter adhered onto the substrate, then introducing the argon gas, and plasma treating the substrate to enable treating in a short time. |
