| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to cool an electronic equipment case body by the exhaust heat of a circuit board with a mounted component such as an MPU having a high heating value and one cooling fan including cooling of other heating component. SOLUTION: A cooling device for an electronic equipment case body is constituted in such a structure that a heat pipe 10 is provided on a circuit board 7 with such a mounted heating element 6 as an MPU via a heat-receiving member 11 and a multitude of radiation fins 12... are mounted to the radiating part of the pipe 10. The fins 12... are formed of plates 14 on the outside of the fins 12 and upper and lower plats 13 as a duct 15, the passage between an intake aperture 3 and a cooling fan 4 is constituted and an action of exhaust heat from another heating member 9 and the like in the interior of the case body 2 can be favorably performed by the fan 4.</p> |
