| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize simultaneous and quick formation of the multiple number of holes at a low cost, by chemically forming holes for external connection terminals of a chip-supporting substrate for a semiconductor package. SOLUTION: A 25μm film, having an insulating layer and a photosensitive layer, is press-bonded on a copper foil of 18μm in thickness by a laminator. The photosensitive layer is printed and developed to make holes, and the insulation layer is etched using the developed layer as an etching resist to make the holes. After the photosensitive layer has been peeled, a circuit is formed on the copper foil using the insulating layer as a support substrate as it is, and the thus the chip-supporting substrate for a semiconductor package can be obtained.</p> |
