| 摘要 |
<p>PROBLEM TO BE SOLVED: To take out a semiconductor wafer from a housing case, without damaging it. SOLUTION: A semiconductor wafer magazine case 10 comprises a slide tray 11 and a slide case 12. The slide tray 11 comprises a flange 11a, while the slide case 12 comprises a hole 12a. The flange 11a is inserted into the hole 12a and made movable. By moving the flange 11a along the hole 12a, the slide tray 11 is pulled out of the side case 12, enabling a semiconductor wafer 13 to be safely taken out, without being damaged.</p> |
