发明名称 ELECTRONIC COMPONENT HOLDING MECHANISM FOR AUTOMATIC ELECTRONIC COMPONENT HARDNESS, AND ELECTRONIC COMPONENT HOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component holding mechanism for automatic electronic component handlers, which can be applied even to lead frames mounting electronic components in a plurality of rows layout. SOLUTION: The electronic component holding mechanism for automatic electronic component handlers, each having a separation mechanism for separating a plurality of electronic components 2 individually at once from a lead frame 1, having a plurality of electronic components 2 mounted in a plurality of rows layout and a pickup transport mechanism 6 for picking up the electronic component 2 separated individually by the separation mechanism and transferring them to the next step, comprises a holding means for arranging the electronic components 2 separated by the separation mechanism in a plurality of rows and temporarily holding them and an X-Y moving means for moving the electronic components held by the holding means to a pickup position of the transfer mechanism 6.
申请公布号 JP2002270622(A) 申请公布日期 2002.09.20
申请号 JP20010066814 申请日期 2001.03.09
申请人 UENO SEIKI KK 发明人 HASE TAKESHI;KATAOKA TADAHARU
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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