PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enable high-density wiring. SOLUTION: A non-through connection hole 9 which is electrically connected to an internal-layer circuit 3 is filled with paste 11 containing metal powder of palladium as a catalyst for nickel plating. On this paste 11 and the end edge 8 of the non-through connection hole 9, a land 13 for mounting an electronic component is formed.