| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a semiconductor device, which enables high density mounting and can prevent generation of voids by devising a mounting process for applying underfill. SOLUTION: The semiconductor device 1 is mounted by the following procedures in this order: (a) printing a cream solder 10 on a printed wiring board 3, (b) applying underfill 14 with a syringe, (c) mounting the semiconductor device 1 with bumps 2 on the printed wiring board, and (d) soldering by melting the cream solder 10 in a reflow furnace, and hardening the underfill 14. The productivity is remarkably improved over the conventional application method, and the flow of the underfill 14 to the side of the semiconductor device 1 can be prevented, avoiding the influence on the neighboring components, and at the same time the strength of the semiconductor device can be increased with the minimum necessary amount of the underfill 14, leading to the reduction in both weight and cost. Furthermore, since the entrainment of voids can be eliminated, the reliability of the semiconductor device 1 is increased after mounting and a repairing work after mounting can be done easily.
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