| 摘要 |
PROBLEM TO BE SOLVED: To provide a pitch converting component of a semiconductor package wherein electric terminals of a semiconductor package can be easily converted to arbitrary pitch, and to provide a pitch converting method. SOLUTION: The pitch converting component 20 of a semiconductor package converts the pitch between rows of electric terminals of a semiconductor package 22 having the electric terminals 21a, 21b which are aligned in two rows, and is provided with a spacer 23 having thickness equal to the pitch E after conversion and a fixing means 25 for fixing the electric terminals 21a, 21b on both end surfaces 24, 24 in the thickness direction of the spacer. By fixing the electric terminals 21a, 21b on both of the end surfaces 24, 24 of the spacer 23 by using the fixing means 25, pitch D of the electric terminals is converted to the pitch E identical to the thickness of the spacer 23.
|
